Manufacturers want to use atom-thick materials like graphene so transistors can become smaller but retain their power; these materials are grown on substrates. The process of peeling the materials from the surface on which they’re manufactured and placing them another surface where devices are made is completed in a one-off manner and can’t be done at scale.
Purdue researchers have created a patent-pending tool that peels 2D materials from one substrate and places them onto another surface. The user can control how much force is used to grab the sample, how fast the peeling occurs, what angle is used to contact the 2D material with the surface, and more. The tool uses a dry-transfer process, removing the need to etch materials that easily contaminate the ultrathin layers.
Thomas Beechem, associate professor of mechanical engineering, College of Engineering
IN THE MEDIA
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“The Purdue invention has the potential to reduce the time required for graphene transfer from hours to minutes, while reducing the amount of contamination.” – Jacob Brejcha, Licensing Associate – Physical Sciences